The paper presents a new type of piezostack driven jetting dispenser, which can be applied to dispense high viscosity adhesives in microelectronic packaging process. According to the bond graph technique, a dynamic model and governing equations are derived from integrating the sub-models of the electromechanical part and the fluid part of the dispenser. Based on the proposed model, the jetting dispenser is manufactured, and its performance is then evaluated through both computer simulation and experimental investigation. The results verify the dispenser's jetting ability and the model's validity, and provide support for the design and control studies of the proposed dispenser.