TSV (Through-silicon Via) is applied to 3D integrated circuits, which meets the demands of high speed and low power consumption. However, high density of TSV implementation exacerbates crosstalk noise which will reduce the transmission reliability. Due to temporal and spatial locality of signal transmission, some signal TSVs can be used for shielding. In this paper, we propose a crosstalk avoidance scheme based on re-layout of signal TSV. Two parameters, crosstalk index and unshielded index, are proposed in this paper to describe the shielding effect of signal TSV re-layout. Both of the indexes are optimized by using non-dominated sorting genetic algorithm II (NSGA-II). We implemented our scheme based on SPEC2006 trace-driven simulation. Result shows that the number of transmission patterns that cause worst crosstalk decreases by 28.8%. And transmission time is reduced by 14.8%. Compared with other algorithms, our work achieves the same or even better results without redundancy TSVs.