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Inductively-Coupled MEMS Pressure Sensor | IEEE Conference Publication | IEEE Xplore

Inductively-Coupled MEMS Pressure Sensor


Abstract:

This research paper introduces a novel design of an inductive sensor based on a MEMS (Micro-Electro-Mechanical System) inductive link. The sensor comprises two identical ...Show More

Abstract:

This research paper introduces a novel design of an inductive sensor based on a MEMS (Micro-Electro-Mechanical System) inductive link. The sensor comprises two identical Al inductor coils micromachined on each side of a thinned silicon wafer. The sensing coil is suspended over a 30μm cavity etched in the silicon wafer. The sensor was designed, modeled, and simulated using the ANSYS Electronics 3D electromagnetic High-Frequency Simulation Software (HFSS). Simulated results showed that the impedance of the primary coil varied from approximately 2310 Ω to 2775 Ω over a deflection range of 20 μm, indicating an average sensitivity of 23.25 Ω/μm.
Date of Conference: 19-21 October 2023
Date Added to IEEE Xplore: 18 January 2024
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Conference Location: Toronto, ON, Canada

References

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