Abstract:
Higher level system integration to achieve better performance and lower cost has consistently driven new technologies. The solutions are no longer just monolithic; in som...Show MoreMetadata
Abstract:
Higher level system integration to achieve better performance and lower cost has consistently driven new technologies. The solutions are no longer just monolithic; in some cases the best solution involves innovative new packaging approaches and in others on-chip integration of different technologies. This session presents several approaches that may best solve particular application challenges.
Published in: 2008 IEEE Custom Integrated Circuits Conference
Date of Conference: 21-24 September 2008
Date Added to IEEE Xplore: 17 November 2008
ISBN Information: