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Variability in 3-D integrated circuits | IEEE Conference Publication | IEEE Xplore

Variability in 3-D integrated circuits


Abstract:

In recent years, there has been a trend among digital and analog circuit designers towards three-dimensional integration. There has been some debate regarding the applica...Show More

Abstract:

In recent years, there has been a trend among digital and analog circuit designers towards three-dimensional integration. There has been some debate regarding the applicability of 3-D technology to general logic circuits, especially with regard to thermal issues. We examine process variations on the same layer, across layers, and cross-chip variations. We show how the performance of each layer of the 3-D chip varies with temperature, and demonstrate the effect of heat pipes on circuit performance.
Date of Conference: 21-24 September 2008
Date Added to IEEE Xplore: 17 November 2008
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Conference Location: San Jose, CA, USA

References

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