Abstract:
This paper reviews the technology and design considerations for the implementation of 3 Dimensional integration of memory in a high performance logic environment.Metadata
Abstract:
This paper reviews the technology and design considerations for the implementation of 3 Dimensional integration of memory in a high performance logic environment.
Published in: 2011 IEEE Custom Integrated Circuits Conference (CICC)
Date of Conference: 19-21 September 2011
Date Added to IEEE Xplore: 20 October 2011
ISBN Information:
Contents 