Abstract:
Design robustness is increasingly challenging in large-scale system integration. This session presents solutions to 3D integration, ESD, and on-chip interconnect.Metadata
Abstract:
Design robustness is increasingly challenging in large-scale system integration. This session presents solutions to 3D integration, ESD, and on-chip interconnect.
Date of Conference: 09-12 September 2012
Date Added to IEEE Xplore: 15 October 2012
ISBN Information:
Contents 