In this paper, 4 x 4 substrate integrated dielectric resonator antenna array (SIDRAA) is designed with a two-layer printed circuit board (PCB) process for millimeter-wave applications. 16 dielectric resonator antenna (DRA) elements are integrated in the top layer substrate utilizing the perforation technique, and a compact four-way tree-shape substrate integrated waveguide (SIW) power divider is realized in the bottom layer substrate as the feeding network. So the proposed method provides a co-designed strategy for the DRA arrays, in which the DR elements and the feeding network can be realized with the same PCB process. A 4 x 4 SIDRAA prototype is designed and simulated in millimeter-wave band, and it showed a simulated bandwidth of about 8% for 10-dB return loss. In the passing band, the gain of the 4 x 4 SIDRAA reached up to 15.8 dBi.