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3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip | IEEE Conference Publication | IEEE Xplore

3D-cool: Design and development of adaptive thermal-aware three-dimensional NoC-based multiprocessor chip


Abstract:

The 3D-Cool is a design and validation framework developed for the implementation of three-dimensional multiprocessor chip using a Network on Chip (NoC), a scalable inter...Show More

Abstract:

The 3D-Cool is a design and validation framework developed for the implementation of three-dimensional multiprocessor chip using a Network on Chip (NoC), a scalable interconnection architecture for communication between processing cores. Usually, because of unbalanced utilization of network and computing resources and stacking of multiple dies in massively parallel processing systems, some parts of the network experience more thermal stress and duty cycle in comparison with other parts, which may accelerate chip failure. The design framework includes novel thermal-aware adaptive routing technology developed to optimize on-chip peak temperature. Analysis of the simulation and experimental results shows, the 3D-Cool designs makes the on-chip traffic and thermal distribution uniform.
Date of Conference: 18-20 April 2018
Date Added to IEEE Xplore: 07 June 2018
ISBN Information:
Electronic ISSN: 2473-4683
Conference Location: Yokohama, Japan

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