Multi-band matching solutions for integrated radio transceivers can significantly reduce logistics and manufacturing cost of Worldwide IoT solutions. Short-range low-energy radio solutions usually apply high impedance TX and RX front-ends to achieve high TX efficiency and exceptional RX sensitivity, and thus the matching network design is one of the major bottlenecks of designing, especially multi-band, modules. This paper introduces a novel use of a 3-element resonator structure that behaves as a frequency-dependent inductance or capacitance, and thus can be the basic building blocks of multi-band matching circuits. The design methodology including analytical formulas, challenges and tuning process of dual- and multi-band matching balun networks applicable for any radios with high impedance differential ports is shown in this paper.