The gallium nitride (GaN) material system has become one of the most promising material systems for high efficiency power switching applications due to its unique material properties, including a wide band gap, high critical electric field, and large mobility and saturation electron velocity. For high voltage, high current applications, vertical device structures on bulk GaN substrates are especially promising [1]. Although the ability to scale the devices to large absolute currents is critical for power electronics, to date the current-carrying capability of many demonstrated devices has fallen short of theoretical expectations due to non-idealities in device area scaling. High performance vertical GaN-on-GaN p-n diodes using N ion-implantation edge termination incorporating a partially-compensated layer were demonstrated to achieve breakdown voltages of 1.2 kV, and both the reverse and forward current densities were found to scale well with area [2]. In this work, a device structure designed for higher breakdown operation was explored, and devices with a range of areas were fabricated and tested under high-current drive conditions. Peak forward currents approaching 10 A at a forward voltage of 5.3 V were obtained for typical 550 μm diameter GaN-on-GaN p-n diodes having a breakdown voltage of 1.6 kV.