Abstract:
Process variation occurring during fabrication of complex VLSI devices induce uncertainties in operation parameters (e.g., supply voltage) to be applied to each device in...Show MoreMetadata
Abstract:
Process variation occurring during fabrication of complex VLSI devices induce uncertainties in operation parameters (e.g., supply voltage) to be applied to each device in order for it to fit within the allowed power budget and get the optimum power efficiency. Therefore, an efficient post manufacturing performance estimation mechanism is needed in order to tune operation parameters for each device during production. The current state-of-the-art approach of using Process Monitoring Boxes (PMBs) have shown some limitations in terms of cost and accuracy that limit their benefit. Simulation results on ISCAS'99 benchmarks using 28nm FD-SOI library show that the accuracy of PMB approaches is design dependent, and requires up to 8.20% added design margin. To overcome those limitations, in this paper we propose an alternative solution using transition fault (TF) test patterns, which is able to eliminate the need for PMBs, while improving the accuracy of performance estimation. The paper discusses a case study on real silicon comparing the performance estimation using functional test patterns and the TF based approach on a 28nm FD-SOI CPU. The results show a very close correlation between TF test patterns and functional patterns.
Published in: 2017 12th International Conference on Design & Technology of Integrated Systems In Nanoscale Era (DTIS)
Date of Conference: 04-06 April 2017
Date Added to IEEE Xplore: 18 May 2017
ISBN Information: