Concept and experimental results obtained from a pixel detector based on CMOS time-compression charge- injection-devices (TC-CID) with a huge internal photocurrent amplification (-104), fabricated in CMOS silicon-on-insulator (SOI) technology are presented. Here, the readout circuitry is fabricated on highly-doped, 200 nm thick SOI film, while the photogate (PG) detector is fabricated on higher-resistivity handle wafer. The latter, together with the 30 V biasing possibilities enhances the quantum efficiency, especially for irradiations with wavelengths in the near-infra-red (NIR) part of the spectra.