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3D integrated hybrid silicon laser | IEEE Conference Publication | IEEE Xplore

3D integrated hybrid silicon laser


Abstract:

A laser is realized by flip-chip bonding an indium phosphide reflective semiconductor optical amplifier with a turning mirror to a silicon photonic circuit with a surface...Show More

Abstract:

A laser is realized by flip-chip bonding an indium phosphide reflective semiconductor optical amplifier with a turning mirror to a silicon photonic circuit with a surface grating coupler. An external cavity laser is formed and single-mode CW lasing is demonstrated.
Date of Conference: 27 September 2015 - 01 October 2015
Date Added to IEEE Xplore: 03 December 2015
Electronic ISBN:978-8-4608-1741-3
Conference Location: Valencia, Spain

References

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