Abstract:
We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density mu...Show MoreMetadata
Abstract:
We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density multi-wavelength laser source.
Published in: 2018 European Conference on Optical Communication (ECOC)
Date of Conference: 23-27 September 2018
Date Added to IEEE Xplore: 15 November 2018
ISBN Information: