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A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O | IEEE Conference Publication | IEEE Xplore

A Bandwidth-Dense, Low Power Electronic-Photonic Platform and Architecture for Multi-Tbps Optical I/O


Abstract:

We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density mu...Show More

Abstract:

We present a high bandwidth-density photonic interconnect platform that transmits 1.05 Tbps/mm2 using 0.83 pJ/bit, integrated in a 45nm SOI process, and a high-density multi-wavelength laser source.
Date of Conference: 23-27 September 2018
Date Added to IEEE Xplore: 15 November 2018
ISBN Information:
Conference Location: Rome, Italy

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