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Reconfigurable Board-to-Board Interconnect Utilizing Bistable Compliant Ribbon Wires | IEEE Conference Publication | IEEE Xplore

Reconfigurable Board-to-Board Interconnect Utilizing Bistable Compliant Ribbon Wires


Abstract:

We propose a printed circuit board (PCB) interconnection utilizing elastically deformed ribbon wires. The wire deflection is designed as a bistable snapping mechanism, wh...Show More

Abstract:

We propose a printed circuit board (PCB) interconnection utilizing elastically deformed ribbon wires. The wire deflection is designed as a bistable snapping mechanism, which enables post-assembly tuning of the geometry. Hence, a reconfigurable inductance is obtained, easing impedance matching and supporting signal integrity. Analytical solutions for partial and mutual inductance of buckled wires are developed, which are successfully validated by magneto-quasistatic field simulations and by experiments on a test structure for frequencies ranging from 100kHz to 100MHz. We demonstrate a tunable loop inductance from 25nH to 50nH at 10MHz.
Date of Conference: 07-09 October 2024
Date Added to IEEE Xplore: 06 November 2024
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Conference Location: Torino, Italy

References

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