Abstract:
Presented work introduces automated interaction of SDevice and HSPICE for fast 3-D electrothermal simulation. The proposed methodology maintains a very high accuracy of t...Show MoreMetadata
Abstract:
Presented work introduces automated interaction of SDevice and HSPICE for fast 3-D electrothermal simulation. The proposed methodology maintains a very high accuracy of the modelled parameters in a wide range of dynamic temperature fluctuations, which brings the thermal simulations much closer to the real state. The designed electrothermal simulation is developed for Synopsys TCAD Sentaurus environment. The main goal is decreasing the simulation time for complex 3-D devices. A DC-DC converter module in a multi-die integrated circuit is used as an example to perform validation of the designed electrothermal simulation. The features and limitations of the method are analyzed and presented.
Date of Conference: 22-26 September 2014
Date Added to IEEE Xplore: 06 November 2014
ISBN Information: