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Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips | IEEE Conference Publication | IEEE Xplore

Hybrid Systems in foil (HySiF) exploiting ultra-thin flexible chips


Abstract:

Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed ele...Show More

Abstract:

Electronics embedded in foil is an enabling technology for flexible electronics and for special form factors of electronic components. In contrast to strictly printed electronics, Hybrid Systems-in-Foil (HySiF), comprising thin flexible, embedded chips and large-area thin-film electronic elements, feature a versatile and reliable technological solution for industrial applications of flexible electronics. This paper provides a comprehensive overview of HySiF technology, including aspects of thin-chip fabrication, reliability and assembly. Also presented is an industrial demonstrator utilizing such a HySiF component.
Date of Conference: 22-26 September 2014
Date Added to IEEE Xplore: 06 November 2014
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ISSN Information:

Conference Location: Venice Lido, Italy

References

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