Abstract:
■ All memory continues to scale, increasingly difficult and complex ■ New DRAM architectures in work across all major application areas ■ Numerous very high bandwidth opt...Show MoreMetadata
Abstract:
■ All memory continues to scale, increasingly difficult and complex ■ New DRAM architectures in work across all major application areas ■ Numerous very high bandwidth options with GDDR5X as highest BW/$ ■ HMC delivers unique advantages for ultra-high bandwidth applications ■ Emergence of Persistent Memory, first as DRAM+NAND NVDIMM - Evolving, enabling new and better products ■ 2016 production of first new memory technology in decades: 3D XPoint™ Memory ■ The future: blending the many existing and new memory types - Overall cost and performance tuned to the application
Published in: 2016 IEEE Hot Chips 28 Symposium (HCS)
Date of Conference: 21-23 August 2016
Date Added to IEEE Xplore: 01 June 2017
ISBN Information: