Abstract:
In recent times there has been a substantial increase in the cost and complexity of fabricating a VLSI chip. The lithography masks themselves can cost between /spl epsi/ ...Show MoreMetadata
Abstract:
In recent times there has been a substantial increase in the cost and complexity of fabricating a VLSI chip. The lithography masks themselves can cost between /spl epsi/ and /spl ges/. It is conjectured that due to these increasing costs, the number of ASIC starts in the last few years has declined. We address this problem by using an array of dynamic PLAs which require only metal and via mask customization in order to implement a new design. This would allow several similar-sized designs to share the same base set of masks (right up to the metal layers) and only have different metal and via masks. We have implemented our methodology for both combinational and sequential designs, and demonstrate that our approach strikes a reasonable compromise between ASIC and field programmable design methodologies in terms of placed-and-routed area and delay. Our method has a 2.89/spl times/ (3.58/spl times/) delay overhead and a 4.96/spl times/ (3.44/spl times/) area overhead compared to standard cells for combinational (sequential) designs.
Date of Conference: 07-11 November 2004
Date Added to IEEE Xplore: 31 January 2005
Print ISBN:0-7803-8702-3
Print ISSN: 1092-3152