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Defect Detection on Wafer Map Using Efficient Convolutional Neural Network | IEEE Conference Publication | IEEE Xplore

Defect Detection on Wafer Map Using Efficient Convolutional Neural Network

Publisher: IEEE

Abstract:

In semiconductor manufacturing, defect patterns on wafer maps hide important information about production problems. Therefore, the detection and identification of wafer p...View more

Abstract:

In semiconductor manufacturing, defect patterns on wafer maps hide important information about production problems. Therefore, the detection and identification of wafer pattern defects are one of the important topics in semiconductor manufacturing. Since there are few datasets of wafer maps, this paper solves the problem of overfitting by classifying wafer map defects using the model base on MobileNet V2. Finally, the accuracy of the WM-811K dataset reaches 96.56%.
Date of Conference: 15-17 September 2021
Date Added to IEEE Xplore: 18 November 2021
ISBN Information:

ISSN Information:

Publisher: IEEE
Conference Location: Penghu, Taiwan

References

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