The wire bonding is an important method in microwave device interconnection. It is widely employed in SIP and MCM. With the increase of frequency, the introduction of gold wire can lead to deterioration of circuit performance. Existing methods to improve circuit performance are to compensate for the identified bonding line, but the gold wire used in the hybrid microwave circuit is often bonded by hand. There inevitably exists the parametric uncertainty, such as the drop point of the gold wire, due to the deviations in the operation process. This causes the aforementioned matching method to be impossible to adapt to all situations in the actual processing. A method for the matching of bond-wire based on Monte Carlo method is proposed in allusion to the uncertainty of the wire bonding in actual matching. Based on the measured data of gold wire bonding, the artificial error is taken into account for the modeling and analysis of the gold wire interconnection structure. Feedback the obtained model and parameters to the VBS based Monte Carlo simulator. In the simulator, the bond-wire model based on statistical properties is optimized, then the optimal matching of the gold wire is realized. In the 1-6GHz range, the maximum echo loss after matching is about 5dB lower than before.