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Reliability driven guideline for BEOL Optimization: Protecting MOS stacks from hydrogen-related impurity penetration | IEEE Conference Publication | IEEE Xplore

Reliability driven guideline for BEOL Optimization: Protecting MOS stacks from hydrogen-related impurity penetration


Abstract:

This paper reviews our recent experiments that correlate the F-N stress-induced gate dielectric degradation with the hydrogen-related (H) species permeability of the line...Show More

Abstract:

This paper reviews our recent experiments that correlate the F-N stress-induced gate dielectric degradation with the hydrogen-related (H) species permeability of the liner nitride (SiN) film. The H permeability of SiN films was found to depend on the deposition process and the post-deposition treatment. A specific ultrathin oxynitride in the near surface region of N2-annealed SiN films was discovered, which has the potential to function as an H-diffusion barrier. Adopting SiN films that effectively block the H-related impurity penetration is a promising route to improve the reliability of dielectrics film applied for FLASH memories.
Date of Conference: 30 May 2012 - 01 June 2012
Date Added to IEEE Xplore: 09 July 2012
ISBN Information:
Print ISSN: 2381-3555
Conference Location: Austin, TX, USA

References

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