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High vertical aspect ratio LIGA microwave 3-dB coupler | IEEE Conference Publication | IEEE Xplore

High vertical aspect ratio LIGA microwave 3-dB coupler


Abstract:

This paper focuses on microwave directional couplers fabricated using synchrotron deep X-ray lithography (DXRL), an advanced micro- and nanofabrication technology allowin...Show More

Abstract:

This paper focuses on microwave directional couplers fabricated using synchrotron deep X-ray lithography (DXRL), an advanced micro- and nanofabrication technology allowing the design of microwave structures with improved performance by exploring the third dimension - metal height. Demonstrated are the influence of increased metal height on the structure characteristics and performance unattainable through conventional planar fabrication techniques.
Date of Conference: 23-23 July 2003
Date Added to IEEE Xplore: 18 August 2003
Print ISBN:0-7695-1947-4
Conference Location: Banff, AB, Canada

References

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