Abstract:
In this paper we evaluate the effectiveness of different testing schemes in detecting resistive-open defects in adder circuits implemented using different CMOS technologi...View moreMetadata
Abstract:
In this paper we evaluate the effectiveness of different testing schemes in detecting resistive-open defects in adder circuits implemented using different CMOS technologies (45 nm, 32 nm, 22 nm and 16 nm). We assess the detection capabilities of four testing techniques taking into consideration the wide process variations associated with the different nanometer technologies. The first three techniques are based on the transient supply current, i
DDT
, and the fourth technique is based on delay testing. The first i
DDT
method uses the RMS value of the wavelet transform of the transient power supply or ground currents. The second one uses the normalized RMS value of the wavelet transform. The third one uses the peak value of i
DDT
. The fourth technique measures the primary input-to-output delay. The experimental results show that the delay test is the most effective among all tests. The i
DDT
test with normalized RMS value of wavelet transform comes second. The other two tests were less effective than the first two, especially in the case of smaller technologies (22 and 16 nm).
Date of Conference: 11-14 December 2011
Date Added to IEEE Xplore: 05 January 2012
ISBN Information: