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Reduction of thermal cycling to increase the lifetime of MOSFET motor drives | IEEE Conference Publication | IEEE Xplore

Reduction of thermal cycling to increase the lifetime of MOSFET motor drives


Abstract:

The variation of the temperature in semiconductors, caused by the load profile, results in the long term in material fatigue. A distinction can be made between the averag...Show More

Abstract:

The variation of the temperature in semiconductors, caused by the load profile, results in the long term in material fatigue. A distinction can be made between the average temperature and the temperature swing, where the temperature swing has a significant effect on the lifetime of a semiconductor. Therefore, the auxiliary-pole topology is proposed to reduce the temperature swing of the MOSFETs in a motor drive. The auxiliary-pole topology divides the load current over two switching-legs and circulates a current when there is a low or zero load current. The conventional half bridge topology is used as a benchmark. Both topologies are simulated with the same load profile and with an equal total amount of silicon. The results show a reduction of the temperature swing and an increase in average temperature of the switches in the auxiliary-pole topology. This leads to an significant improvement in cycles to failure and time to failure.
Date of Conference: 29 October 2014 - 01 November 2014
Date Added to IEEE Xplore: 26 February 2015
Electronic ISBN:978-1-4799-4032-5
Print ISSN: 1553-572X
Conference Location: Dallas, TX, USA

References

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