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Study on the method of thermal prediction for electronic wing pod cabin | IEEE Conference Publication | IEEE Xplore

Study on the method of thermal prediction for electronic wing pod cabin


Abstract:

For airborne electronic equipment, temperature is the most important factor affecting its performance, so it is very important to invest its dynamic temperature response ...Show More

Abstract:

For airborne electronic equipment, temperature is the most important factor affecting its performance, so it is very important to invest its dynamic temperature response process in a flight environment. By analyzing the heat exchange relationship between different devices in an electronic wing pod cabin, a temperature prediction method for electronic pod cabin based on the Random Vector Functional Link (RVFL) neural network is proposed in this paper. This method can complete a construction of prediction model using small amount of data. Hence it can realize a quick temperature response prediction only with the initial temperature values, and ensure relative high prediction accuracy.
Date of Conference: 29 October 2017 - 01 November 2017
Date Added to IEEE Xplore: 18 December 2017
ISBN Information:
Conference Location: Beijing, China

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