Abstract:
Future implantable medical devices will be highly miniaturized and almost certainly leverage die-level electronics miniaturization and packaging. Here, an integrated ultr...Show MoreMetadata
Abstract:
Future implantable medical devices will be highly miniaturized and almost certainly leverage die-level electronics miniaturization and packaging. Here, an integrated ultra-high density packaging platform is proposed to enable a new class of medical devices. Dense modules are obtained by interconnecting existing ASICs and discrete components using a process which achieves the highest packaging densities available.
Published in: 2011 Annual International Conference of the IEEE Engineering in Medicine and Biology Society
Date of Conference: 30 August 2011 - 03 September 2011
Date Added to IEEE Xplore: 01 December 2011
ISBN Information:
ISSN Information:
PubMed ID: 22254946