Ultra-high density packaging technology for injectable medical devices | IEEE Conference Publication | IEEE Xplore

Ultra-high density packaging technology for injectable medical devices


Abstract:

Future implantable medical devices will be highly miniaturized and almost certainly leverage die-level electronics miniaturization and packaging. Here, an integrated ultr...Show More

Abstract:

Future implantable medical devices will be highly miniaturized and almost certainly leverage die-level electronics miniaturization and packaging. Here, an integrated ultra-high density packaging platform is proposed to enable a new class of medical devices. Dense modules are obtained by interconnecting existing ASICs and discrete components using a process which achieves the highest packaging densities available.
Date of Conference: 30 August 2011 - 03 September 2011
Date Added to IEEE Xplore: 01 December 2011
ISBN Information:

ISSN Information:

PubMed ID: 22254946
Conference Location: Boston, MA, USA

References

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