This paper presents a novel 3-DOF hybrid kinematics robot composed of planar parallel mechanism including parallelogram linkages and linear drive, which are used for wire bonding of microelectronic device. Combining the advantages of parallel mechanism and direct drive, the robot can achieve high precision and high acceleration. The structure of the robot is optimized from the view of both kinematics and dynamics respectively. The experimental results demonstrated that the repeatability, acceleration and settling time of the robot can satisfy the proposed application.