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Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression | IEEE Conference Publication | IEEE Xplore

Electromigration Early Failures for Cu Pillar Interconnections with an ENEPIG Pad Finish and its Suppression


Abstract:

The lifetime distribution of electromigration in a Cu pillar interconnection with Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG or Ni-P/Pd/Au) pad finis...Show More

Abstract:

The lifetime distribution of electromigration in a Cu pillar interconnection with Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG or Ni-P/Pd/Au) pad finish was investigated. The Cu pillar interconnection with a Ni cap showed a bimodal lifetime distribution under high current stressing. It was found that Ni diffusion from the pad finish to solder plays a key role in the mechanism of this early failure mode. By removing the Ni cap and increasing the ratio of the Cu post diameter to solder resist opening size, we could achieve a significant suppression of the early failure.
Date of Conference: 31 March 2019 - 04 April 2019
Date Added to IEEE Xplore: 23 May 2019
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Conference Location: Monterey, CA, USA

References

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