Abstract:
The lifetime distribution of electromigration in a Cu pillar interconnection with Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG or Ni-P/Pd/Au) pad finis...Show MoreMetadata
Abstract:
The lifetime distribution of electromigration in a Cu pillar interconnection with Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG or Ni-P/Pd/Au) pad finish was investigated. The Cu pillar interconnection with a Ni cap showed a bimodal lifetime distribution under high current stressing. It was found that Ni diffusion from the pad finish to solder plays a key role in the mechanism of this early failure mode. By removing the Ni cap and increasing the ratio of the Cu post diameter to solder resist opening size, we could achieve a significant suppression of the early failure.
Date of Conference: 31 March 2019 - 04 April 2019
Date Added to IEEE Xplore: 23 May 2019
ISBN Information: