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Toward a Low Power E-Skin Interface System on a Chip for Taxel Arrays | IEEE Conference Publication | IEEE Xplore

Toward a Low Power E-Skin Interface System on a Chip for Taxel Arrays


Abstract:

Electronic skin (e-skin) interface building blocks are presented that are suitable for integration with array-based tactile sensors for prosthetic applications. The first...Show More

Abstract:

Electronic skin (e-skin) interface building blocks are presented that are suitable for integration with array-based tactile sensors for prosthetic applications. The first is a low power, low noise capacitive transimpedance amplifier (CTIA) compatible with charge-based polyvinylidene fluoride (PVDF) sensors. The second is a high efficiency RISC-V microcontroller unit (MCU) with a custom, on-chip neural processing unit (NPU) to accelerate gesture recognition tasks. Two test chips have been fabricated using a 65 nm CMOS technology: one for the prototype analog front-end (AFE) including the CTIA, and the other for the MCU and NPU. The AFE consumes 112.5 nW per channel, and the MCU consumes 2.83 mW while running the NPU at 112 MHz.
Date of Conference: 12-14 October 2020
Date Added to IEEE Xplore: 28 September 2020
Print ISBN:978-1-7281-3320-1
Print ISSN: 2158-1525
Conference Location: Seville, Spain

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