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Multi-programming environment for structure under pads (SUP) and via arrays pattern recognition automated classification system | IEEE Conference Publication | IEEE Xplore

Multi-programming environment for structure under pads (SUP) and via arrays pattern recognition automated classification system


Abstract:

In today's IC Design, EDA tools are not limited to IC designer's toys. The application of EDA has expanded into a larger scope including generation and extraction of crit...Show More

Abstract:

In today's IC Design, EDA tools are not limited to IC designer's toys. The application of EDA has expanded into a larger scope including generation and extraction of critical information of a design for yield, quality and reliability analysis.
Date of Conference: 22-24 March 2010
Date Added to IEEE Xplore: 15 April 2010
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ISSN Information:

Conference Location: San Jose, CA, USA

References

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