A 275mW heterogeneous multimedia processor for IC-stacking on Si-interposer | IEEE Conference Publication | IEEE Xplore

A 275mW heterogeneous multimedia processor for IC-stacking on Si-interposer


Abstract:

Most data-intensive operations for multimedia applications such as image processing, vision, and 3D graphics require high external memory bandwidth. In augmented-reality ...Show More

Abstract:

Most data-intensive operations for multimedia applications such as image processing, vision, and 3D graphics require high external memory bandwidth. In augmented-reality (AR) processors [1], both 3D graphics and vision operations are required, so memory bandwidth becomes even more critical. In [1], however, memory bandwidth is not considered, floating-point processing is not supported, and there is no cache memory for texturing, which is a performance bottleneck of common graphics pipelines. In this work, a heterogeneous multimedia processor is presented to process various mobile multimedia applications in a single chip on Si-interposer for high memory bandwidth. The implemented processor has 4 key features: (1) A transceiver pool (TRx) that reconfigures strength of output drivers according to the channel loss for IC-stacking on Si interposer, (2) A mode-configurable vector processing unit (MCVPU) for frame level parallelism, (3) An energy-efficient unified filtering unit (UFU) with adaptive block selection (ABS) algorithm for memory-access-efficient texturing, and (4) a unified shader (US) with floating-point scalar processing elements (SPE) and partial special function units (PSFU) to enhance graphics processing perform ance and quality. With these techniques, we achieve 1.7χ frame rate and 8χ memory bandwidth improvement in full AR operation.
Date of Conference: 20-24 February 2011
Date Added to IEEE Xplore: 07 April 2011
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Conference Location: San Francisco, CA, USA

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