Abstract:
There is enormous demand for high-bandwidth DRAM: in application such as HPC, graphics, high-end server and artificial intelligence. HBM DRAM was developed [1] using the ...Show MoreMetadata
Abstract:
There is enormous demand for high-bandwidth DRAM: in application such as HPC, graphics, high-end server and artificial intelligence. HBM DRAM was developed [1] using the advances in package technology: TSV, microbump and silicon-interposer. Owing to these advances, HBM has a much higher bandwidth, at a lower pin speed rate, than conventional DRAM. However, the 3D-stack structure causes TSV interface and PDN problems: TSV connection failure and 3D-accumulation of IR drop, which increases the total cost of HBM. Moreover, as memory bandwidth increases DRAM architectural challenges arise, power consumption and associated thermal problems increase as well.
Date of Conference: 16-20 February 2020
Date Added to IEEE Xplore: 13 April 2020
ISBN Information: