In modern integrated circuits, the Electromigration (EM) effects are not just seen on power delivery networks. EM is also an increasing problem in the internal metal wires of cells, referred as cell-internal signal Electromigration. In this work we present a detailed analysis of the cell-internal signal Electromigration effects considering different logic gates. The lifetime optimization by placing the output pin of the gates is dependent of the output wire shape and the logic of the gate. We are also presenting ways to improve the lifetime of the cells optimizing the cell layout.