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Delay Characterization and Testing of Arbitrary Multiple-Pin Interconnects | IEEE Journals & Magazine | IEEE Xplore

Delay Characterization and Testing of Arbitrary Multiple-Pin Interconnects


Abstract:

Detection of delay faults in 3-D interconnects is crucial for building reliable 3-D ICs. This paper presents a test methodology based on a globalring structure with a var...Show More

Abstract:

Detection of delay faults in 3-D interconnects is crucial for building reliable 3-D ICs. This paper presents a test methodology based on a globalring structure with a variable output thresholding technique to detect delay faults in multipin 3-D interconnects in multidie 3-D ICs. The proposed test architecture with an enhanced clock period measurement circuit detects delay faults in multipin 3-D interconnects with an accuracy of 10 ps.
Published in: IEEE Design & Test ( Volume: 33, Issue: 2, April 2016)
Page(s): 9 - 16
Date of Publication: 10 July 2015

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