In this paper, we proposed a new fabrication method of thick film structure which has rectangular cross-sectional shape. This fabrication method utilized a new sputtering jig consisting of substrate and spacer units. The surface level of spacer unit is lower than one of substrate unit. After thick film deposition, the spacer unit is removed. In comparison with conventional sputtering and lift off process, thickness uniformity of structure fabricated by this method is improved dramatically. Finally, we fabricated the two-axis scanning micro mirror device which has coil element on the thick film structure of Parylene-C/Cu-Zr-Ti thin film metallic glass. This device achieved the optical scan angles of horizontal 10 degrees and vertical 10 degrees.