Abstract:
This study reports a combinational method of tensile testing with TEM observation to observe the local area in a large magnified view. Our target material is single-cryst...Show MoreMetadata
Abstract:
This study reports a combinational method of tensile testing with TEM observation to observe the local area in a large magnified view. Our target material is single-crystal silicon that behaves in a brittle manner under tension until fracture in general. We developed a novel silicon chip for tensile testing of nanoscale silicon film with compliant mechanism for maintaining the observation point on the tensile specimen. The experimental results showed crack initiation and then incredibly crack shielding in single-crystal silicon under tensile loading.
Date of Conference: 09-12 December 2018
Date Added to IEEE Xplore: 31 October 2019
ISBN Information: