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Volume: 37 Issue: 5
From Cool Chips to Hot Interconnects
Publisher:
IEEE
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Lieven Eeckhout
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Abstract:
This column briefly introduces the articles and departments in the issue.
Metadata
Abstract:
This column briefly introduces the articles and departments in the issue.
Published in:
IEEE Micro
(
Volume: 37
,
Issue: 5
, September/October 2017
)
Page(s):
4
- 5
Date of Publication:
11 October 2017
ISSN Information:
DOI:
10.1109/MM.2017.3711649
Publisher:
IEEE
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