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Design, fabrication and characterization of a single-chip three-dimensional electric field microsensor | IEEE Conference Publication | IEEE Xplore

Design, fabrication and characterization of a single-chip three-dimensional electric field microsensor


Abstract:

We propose a single-chip three-dimensional (3D) electric field microsensor with advantages of small size and high integration. Three orthogonal sensing axes are placed in...Show More

Abstract:

We propose a single-chip three-dimensional (3D) electric field microsensor with advantages of small size and high integration. Three orthogonal sensing axes are placed in one chip, in which one sensing element is set in the middle to detect the Z-axis electrostatic field component, and two pairs of sensing elements are designed into the same structure and cross-like arranged to measure X-axis and Y-axis electrostatic field components. In-plane rotary mechanism and strip-type electrodes are adopted in the design. This microsensor is fabricated in a MetalMUMPS process. Experimental results show that the proposed microsensor has linearity errors within 5.5% and electrostatic field measurement errors less than 14.0% in the range of 0~50kV/m.
Date of Conference: 09-12 April 2017
Date Added to IEEE Xplore: 29 August 2017
ISBN Information:
Electronic ISSN: 2474-3755
Conference Location: Los Angeles, CA, USA

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