We previously showed that microparts can be fed along an asymmetric microfabricated surface using simple planar symmetric vibrations. Microparts move in one direction because they adhere to the microfabricated surface asymmetrically. We developed sawtoothed surfaces with an elevation angle of 20 deg and various pitches of from 10 to 100 micrometer on the surface of silicon wafer material using a dicing saw with a bevel type blade. We also evaluated the movement of sub-millimeter microparts such as 0603 (size, 0.6 × 0.6 × 0.3 mm; weight, 0.3 mg) and 0402 (size, 0.4 × 0.2 × 0.2 mm; weight, 0.1 mg) capacitors. Then we found that there were fabrication errors and cracks on the top of teeth, and they caused variations of contact between fed microparts and feeder surfaces, which affected the feeding stability of microparts. In the present work, we applied the etching process of single crystal silicon to develop higher accurate and uniform asymmetric fabricated surfaces. Using a silicon wafer with a plain orientation of [221], an asymmetric periodic structure is generated on its surface because the etching speed is different between forward and backward of the crystal face. Three types of etched surfaces were obtained by adjusting the etching parameter. The surface profiles of each surface were measured using a scanning electron microscopy (SEM) system. We also examined the tribologic characteristics by the measurements experiments of the angle of friction of microparts. Finally, we conducted feeding experiments of microparts using these surfaces and compared feeding velocity on each surface.