An advantage of 3-D integrated circuits is the possibility to integrate heterogeneous technologies on separate device planes. The device planes are fabricated in different technologies operating at distinct power supply voltages. A mechanism to detect and set the power supply voltage of each domain within each device plane of a 3-D IC is described. The detection of the power supply voltage is achieved through the placement of a ring oscillator circuit in each voltage domain. The current is supplied at the set voltage to the device plane through dedicated power modules comprising of a frequency to voltage converter and a dependent voltage source placed on a dedicated power plane. The functionality of the supply voltage detection and delivery circuits is verified through SPICE simulation of the device plane (22 nm technology) and power plane (45 nm technology). The implementation of the proposed circuits for 3-D IC design facilitate a plug-and-play approach for the integration of heterogeneous technologies.