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Overlay-Aware Detailed Routing for Self-Aligned Double Patterning Lithography Using the Cut Process | IEEE Journals & Magazine | IEEE Xplore

Overlay-Aware Detailed Routing for Self-Aligned Double Patterning Lithography Using the Cut Process

Publisher: IEEE

Abstract:

Self-aligned double patterning (SADP) is one of the most promising techniques for sub-20 nm technology. Spacer-is-dielectric SADP using a cut process is getting popular b...View more

Abstract:

Self-aligned double patterning (SADP) is one of the most promising techniques for sub-20 nm technology. Spacer-is-dielectric SADP using a cut process is getting popular because of its higher design flexibility; for example, it can decompose odd cycles without the need of inserting any stitch. This paper presents the first work that applies the cut process for decomposing odd cycles during routing. For SADP, further, overlay control is a critical issue for yield improvement; while published routers can handle only partial overlay scenarios, this paper identifies all the scenarios that induce overlays and proposes a novel constraint graph to model all overlays. With the developed techniques, our router can achieve high-quality routing results with significantly fewer overlays (and thus better yields). Compared with three state-of-the-art studies, our algorithm can achieve the best quality and efficiency, with zero cut conflicts, smallest overlay length, highest routability, and fastest running time.
Page(s): 1519 - 1531
Date of Publication: 30 December 2015

ISSN Information:

Publisher: IEEE

Funding Agency:


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