Interlayer liquid cooling network has been considered as one of the effective cooling mechanisms for heat dissipation in three dimensional integrated circuits (3D ICs). In this paper, an optimization approach is proposed for 3D IC interlayer cooling network design with consideration of cooling energy minimization and thermal constraints. First, a channel patterning technique is proposed which adopts straight-channel patterns and corner-barrier patterns to efficiently reduce the temperature of hotspots in the chip. Second, an iterative channel pruning process is proposed for cooling network optimization that reduces the temperature gradient and cooling energy. Furthermore, algebraic multigrid-preconditioned generalized conjugate residual solver is applied for thermal simulation in this optimization process to achieve better computational efficiency. Experimental results have shown that the proposed optimization approach can produce optimal interlayer cooling networks with 11.3%-61.3% cooling energy savings and 49.3%-59.4% pumping pressure savings in comparison with the first place winner of 2015 computer-aided design contest at International Conference on Computer-Aided Design.