Abstract:
Temperature-dependent performance analysis in relation with crosstalk induced noise voltage levels and delay have been studied at the far end of victim and aggressor line...View moreMetadata
Abstract:
Temperature-dependent performance analysis in relation with crosstalk induced noise voltage levels and delay have been studied at the far end of victim and aggressor lines in capacitively coupled mixed CNT (MCB) bundles, respectively. Four possible structures of MCB bundles are taken namely Structure1 (ST-1) Structure-2 (ST-2), Structure -3 (ST-3) and Structure-4 (ST-4) and a comparison of performance is done w.r.t. copper interconnect at 14nm technology node. Compared with all MCB bundle structures, copper has larger crosstalk induced time duration, higher noise voltage peaks and large delay over a temperature range from 300K to 500K for entire length of interconnects.
Published in: TENCON 2019 - 2019 IEEE Region 10 Conference (TENCON)
Date of Conference: 17-20 October 2019
Date Added to IEEE Xplore: 12 December 2019
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