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Temperature-dependent analysis of Crosstalk noise in Capacitively Coupled Interconnects for Mixed Carbon Nanotubes Bundle | IEEE Conference Publication | IEEE Xplore

Temperature-dependent analysis of Crosstalk noise in Capacitively Coupled Interconnects for Mixed Carbon Nanotubes Bundle

Publisher: IEEE

Abstract:

Temperature-dependent performance analysis in relation with crosstalk induced noise voltage levels and delay have been studied at the far end of victim and aggressor line...View more

Abstract:

Temperature-dependent performance analysis in relation with crosstalk induced noise voltage levels and delay have been studied at the far end of victim and aggressor lines in capacitively coupled mixed CNT (MCB) bundles, respectively. Four possible structures of MCB bundles are taken namely Structure1 (ST-1) Structure-2 (ST-2), Structure -3 (ST-3) and Structure-4 (ST-4) and a comparison of performance is done w.r.t. copper interconnect at 14nm technology node. Compared with all MCB bundle structures, copper has larger crosstalk induced time duration, higher noise voltage peaks and large delay over a temperature range from 300K to 500K for entire length of interconnects.
Date of Conference: 17-20 October 2019
Date Added to IEEE Xplore: 12 December 2019
ISBN Information:

ISSN Information:

Publisher: IEEE
Conference Location: Kochi, India

References

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