High Speed I/O Test Cable Assembly Interfaces for Next Generation Multi-Gigabit Serial Protocols | IEEE Conference Publication | IEEE Xplore

High Speed I/O Test Cable Assembly Interfaces for Next Generation Multi-Gigabit Serial Protocols


Abstract:

This poster describes high speed I/O test cable interfaces for next generation multi-gigabit serial protocols such as PCI-Express incorporating 3M¿ shielded controlled im...Show More

Abstract:

This poster describes high speed I/O test cable interfaces for next generation multi-gigabit serial protocols such as PCI-Express incorporating 3M¿ shielded controlled impedance (SCI) connector systems, spring probe board interfaces and low loss twinaxial cable assemblies with performance capabilities up to 12 Gbps.
Date of Conference: 01-06 November 2009
Date Added to IEEE Xplore: 18 December 2009
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Conference Location: Austin, TX, USA