Abstract:
Through-silicon vias (TSVs) are crucial elements of 3-D bonded integrated circuits. Since they connect different layers of 3-D stacks, their proper operation is an essent...Show MoreMetadata
Abstract:
Through-silicon vias (TSVs) are crucial elements of 3-D bonded integrated circuits. Since they connect different layers of 3-D stacks, their proper operation is an essential prerequisite for the system function. This paper describes a procedure for deriving fault diagnosis test sequences to identify single and multiple defective TSVs. Additional experimental results obtained for pseudorandom patterns illustrate feasibility and robustness of the proposed test schemes in terms of their detection and diagnostic capabilities and are reported herein.
Published in: 2013 IEEE International Test Conference (ITC)
Date of Conference: 06-13 September 2013
Date Added to IEEE Xplore: 04 November 2013
Electronic ISBN:978-1-4799-0859-2