Automotive has become one of the most prevailing sectors of the modern semiconductor industry. Due to strict requirements for safety, reliability, and security the proposed test & repair solutions for automotive applications undergo a circumstantial verification before exploitation. Traditionally production defects and soft errors occurring in the operation mode were considered to be the main source of failures for System-on-Chips (SoC). Nevertheless, aging-induced faults especially in modern technology nodes also pose certain challenges for SoC lifetime and impact the overall Failure in Time (FIT) rate of the system. Meanwhile keeping hold of low FIT rate is one of the main criteria for reliability. In this paper, a comprehensive study on aging faults is conducted for FinFET memories and an efficient test & repair methodology is proposed that meets the automotive requirements and allows decreasing the FIT rate of the system.