In this paper, the lifetime prediction of power device modules based on the linear damage accumulation is studied in conjunction with simple mission profiles of converters. Superimposed power cycling conditions, which are called simple mission profiles in this paper, are made based on a lifetime model in respect to junction temperature swing duration. This model has been built based on 39 power cycling test results of 600-V 30-A three-phase-molded IGBT modules. Six tests are performed under three superimposed power cycling conditions using an advanced power cycling test setup. The experimental results validate the lifetime prediction of the IGBT modules based on the linear damage accumulation by comparing the test results with the predicted lifetime from the lifetime model. Furthermore, the test results show the importance of the junction temperature swing duration effect for the lifetime prediction of IGBT modules under power converter applications.