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FDR 2.0: A Low-Power Dynamically Reconfigurable Architecture and Its FinFET Implementation | IEEE Journals & Magazine | IEEE Xplore

FDR 2.0: A Low-Power Dynamically Reconfigurable Architecture and Its FinFET Implementation


Abstract:

Large area/delay/power overheads are required to support the reconfigurability of field-programmable gate arrays (FPGAs). We proposed a hybrid CMOS/nanotechnology dynamic...Show More

Abstract:

Large area/delay/power overheads are required to support the reconfigurability of field-programmable gate arrays (FPGAs). We proposed a hybrid CMOS/nanotechnology dynamically reconfigurable architecture, called NATURE, earlier to address this challenge. It uses the concept of temporal logic folding and fine-grain (i.e., cycle-level) dynamic reconfiguration to increase logic density and save area. Because logic folding reduces area significantly, most of the on-chip communications become localized. To take full advantage of localized communications, we then presented a new CMOS-based fine-grain dynamically reconfigurable (FDR) architecture. It consists of an array of homogeneous logic elements (LEs), which can be configured into logic or interconnect or a combination of both. FDR eliminates most of the long-distance and global wires, which occupy a large amount of area in conventional FPGAs. FDR improves the area-delay product by an order of magnitude relative to conventional architectures. In this paper, we present an augmented FDR 2.0 architecture, where: 1) the LE is augmented with dedicated carry logic to facilitate arithmetic operations; 2) diagonal direct links are incorporated to improve the flexibility of local communication; and 3) coarse-grain blocks, including embedded memories and digital signal processing (DSP) blocks, are added to support fast data-intensive computations. Experimental results show that the coarse-grain design can improve circuit performance by 3.6\times compared with the fine-grain FDR architecture. Incorporation of the DSP blocks in FDR 2.0 also enables more effective area-delay and power-delay tradeoffs, allowing the users to trade performance for smaller area or power consumption. We have implemented the design in the 22-nm FinFET technology, which enables more flexible and effective power management. Finally, different types of FinFETs and power management techniques have been explored in FDR 2.0 to optimize power.
Page(s): 1987 - 2000
Date of Publication: 29 October 2014

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